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authorLinus Torvalds <torvalds@linux-foundation.org>2021-05-05 12:46:48 -0700
committerLinus Torvalds <torvalds@linux-foundation.org>2021-05-05 12:46:48 -0700
commit583f2bcf86a322dc0387f5a868026d2e2fe18261 (patch)
tree9ce028c7f072fc9f2198296cc33b6abe213f537f /MAINTAINERS
parent5d6a1b84e07607bc282ed2ed8e2f128c73697d5c (diff)
parentc310e546164d5cca4c12faf9582b75989b030b68 (diff)
Merge tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano: - Remove duplicate error message for the amlogic driver (Tang Bin) - Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury) - Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund) - Remove duplicate include in ti-bandgap (Zhang Yunkai) - Assign error code in the error path in the function thermal_of_populate_bind_params() (Jia-Ju Bai) - Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian King) - Use the device name instead of auto-numbering for a better identification of the cooling device (Daniel Lezcano) - Improve a bit the division accuracy in the power allocator governor (Jeson Gao) - Enable the missing third sensor on msm8976 (Konrad Dybcio) - Add QCom tsens driver co-maintainer (Thara Gopinath) - Fix memory leak and use after free errors in the core code (Daniel Lezcano) - Add the MDM9607 compatible bindings (Konrad Dybcio) - Fix trivial spello in the copyright name for Hisilicon (Hao Fang) - Fix negative index array access when converting the frequency to power in the energy model (Brian-sy Yang) - Add support for Gen2 new PMIC support for Qcom SPMI (David Collins) - Update maintainer file for CPU cooling device section (Lukasz Luba) - Fix missing put_device on error in the Qcom tsens driver (Guangqing Zhu) - Add compatible DT binding for sm8350 (Robert Foss) - Add support for the MDM9607's tsens driver (Konrad Dybcio) - Remove duplicate error messages in thermal_mmio and the bcm2835 driver (Ruiqi Gong) - Add the Thermal Temperature Cooling driver (Zhang Rui) - Remove duplicate error messages in the Hisilicon sensor driver (Ye Bin) - Use the devm_platform_ioremap_resource_byname() function instead of a couple of corresponding calls (dingsenjie) - Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei) - Add missing property in the DT thermal sensor binding (Rafał Miłecki) - Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe) - Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki) - Replace the thermal_notify_framework() call by a call to the thermal_zone_device_update() function. Remove the function as well as the corresponding documentation (Thara Gopinath) - Add support for the ipq8064-tsens sensor along with a set of cleanups and code preparation (Ansuel Smith) - Add a lockless __thermal_cdev_update() function to improve the locking scheme in the core code and governors (Lukasz Luba) - Fix multiple cooling device notification changes (Lukasz Luba) - Remove unneeded variable initialization (Colin Ian King) * tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits) thermal/drivers/mtk_thermal: Remove redundant initializations of several variables thermal/core/power allocator: Use the lockless __thermal_cdev_update() function thermal/core/fair share: Use the lockless __thermal_cdev_update() function thermal/core/fair share: Lock the thermal zone while looping over instances thermal/core/power_allocator: Update once cooling devices when temp is low thermal/core/power_allocator: Maintain the device statistics from going stale thermal/core: Create a helper __thermal_cdev_update() without a lock dt-bindings: thermal: tsens: Document ipq8064 bindings thermal/drivers/tsens: Add support for ipq8064-tsens thermal/drivers/tsens: Drop unused define for msm8960 thermal/drivers/tsens: Replace custom 8960 apis with generic apis thermal/drivers/tsens: Fix bug in sensor enable for msm8960 thermal/drivers/tsens: Use init_common for msm8960 thermal/drivers/tsens: Add VER_0 tsens version thermal/drivers/tsens: Convert msm8960 to reg_field thermal/drivers/tsens: Don't hardcode sensor slope Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation thermal/core: Remove thermal_notify_framework iwlwifi: mvm: tt: Replace thermal_notify_framework dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema ...
Diffstat (limited to 'MAINTAINERS')
-rw-r--r--MAINTAINERS3
1 files changed, 2 insertions, 1 deletions
diff --git a/MAINTAINERS b/MAINTAINERS
index 303340f6b5a0..203a569c0ce4 100644
--- a/MAINTAINERS
+++ b/MAINTAINERS
@@ -15197,6 +15197,7 @@ F: include/linux/if_rmnet.h
QUALCOMM TSENS THERMAL DRIVER
M: Amit Kucheria <amitk@kernel.org>
+M: Thara Gopinath <thara.gopinath@linaro.org>
L: linux-pm@vger.kernel.org
L: linux-arm-msm@vger.kernel.org
S: Maintained
@@ -18101,7 +18102,7 @@ THERMAL/CPU_COOLING
M: Amit Daniel Kachhap <amit.kachhap@gmail.com>
M: Daniel Lezcano <daniel.lezcano@linaro.org>
M: Viresh Kumar <viresh.kumar@linaro.org>
-M: Javi Merino <javi.merino@kernel.org>
+R: Lukasz Luba <lukasz.luba@arm.com>
L: linux-pm@vger.kernel.org
S: Supported
F: Documentation/driver-api/thermal/cpu-cooling-api.rst